Imaging the 3-D Deformation of the Finger Pad When Interacting with Compliant Materials. [electronic resource]

By: Contributor(s): Publication details: IEEE Haptics Symposium : [proceedings]. IEEE Haptics Symposium Mar 2018Description: 7-13 p. digitalISSN:
  • 2324-7347
Online resources: In: IEEE Haptics Symposium : [proceedings]. IEEE Haptics Symposium vol. 2018
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Publication Type: Journal Article

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