Imaging the 3-D Deformation of the Finger Pad When Interacting with Compliant Materials.
Hauser, Steven C
Imaging the 3-D Deformation of the Finger Pad When Interacting with Compliant Materials. [electronic resource] - IEEE Haptics Symposium : [proceedings]. IEEE Haptics Symposium Mar 2018 - 7-13 p. digital
Publication Type: Journal Article
2324-7347
10.1109/HAPTICS.2018.8357145 doi
Imaging the 3-D Deformation of the Finger Pad When Interacting with Compliant Materials. [electronic resource] - IEEE Haptics Symposium : [proceedings]. IEEE Haptics Symposium Mar 2018 - 7-13 p. digital
Publication Type: Journal Article
2324-7347
10.1109/HAPTICS.2018.8357145 doi