Imaging the 3-D Deformation of the Finger Pad When Interacting with Compliant Materials. (Record no. 29682664)

MARC details
000 -LEADER
fixed length control field 00811 a2200193 4500
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20250518040509.0
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field ####s 0 0 eng d
022 ## - INTERNATIONAL STANDARD SERIAL NUMBER
International Standard Serial Number 2324-7347
024 7# - OTHER STANDARD IDENTIFIER
Standard number or code 10.1109/HAPTICS.2018.8357145
Source of number or code doi
040 ## - CATALOGING SOURCE
Original cataloging agency NLM
Language of cataloging eng
Transcribing agency NLM
100 1# - MAIN ENTRY--PERSONAL NAME
Personal name Hauser, Steven C
245 00 - TITLE STATEMENT
Title Imaging the 3-D Deformation of the Finger Pad When Interacting with Compliant Materials.
Medium [electronic resource]
260 ## - PUBLICATION, DISTRIBUTION, ETC.
Name of publisher, distributor, etc. IEEE Haptics Symposium : [proceedings]. IEEE Haptics Symposium
Date of publication, distribution, etc. Mar 2018
300 ## - PHYSICAL DESCRIPTION
Extent 7-13 p.
Other physical details digital
500 ## - GENERAL NOTE
General note Publication Type: Journal Article
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Gerling, Gregory J
773 0# - HOST ITEM ENTRY
Title IEEE Haptics Symposium : [proceedings]. IEEE Haptics Symposium
Related parts vol. 2018
-- p. 7-13
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier <a href="https://doi.org/10.1109/HAPTICS.2018.8357145">https://doi.org/10.1109/HAPTICS.2018.8357145</a>
Public note Available from publisher's website

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