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	1.	The Impact of Organic Additives on Copper Trench Microstructure. [electronic resource] by Marro, James B Okoro, Chukwudi A Obeng, Yaw S Richardson, Kathleen C Publication details: Journal of the Electrochemical Society 2017 In: Journal of the Electrochemical Society vol. 164 Online resources: Available from publisher's website Availability: No items available. Save to lists Add to cart (remove)
	2.	The Influence of Pulsed Electroplating Frequency and Duty Cycle on Copper Film Microstructure and Stress State. [electronic resource] by Marro, James B Darroudi, Taghi Okoro, Chukwudi A Obeng, Yaw S Richardson, Kathleen C Publication details: Thin solid films Jan 2017 In: Thin solid films vol. 621 Online resources: Available from publisher's website Availability: No items available. Save to lists Add to cart (remove)
	3.	Towards Understanding Early Failures Behavior during Device Burn-In: Broadband RF Monitoring of Atomistic Changes in Materials. [electronic resource] by Obeng, Yaw S Okoro, Chukwudi A Amoah, Papa K Dai, Johnny Vartanian, Victor H Publication details: ECS journal of solid state science and technology : JSS 2016 In: ECS journal of solid state science and technology : JSS vol. 5 Online resources: Available from publisher's website Availability: No items available. Save to lists Add to cart (remove)

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