The Influence of Pulsed Electroplating Frequency and Duty Cycle on Copper Film Microstructure and Stress State. [electronic resource]

By: Contributor(s): Publication details: Thin solid films Jan 2017Description: 91-97 p. digitalISSN:
  • 0040-6090
Online resources: In: Thin solid films vol. 621
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Publication Type: Journal Article

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