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	1.	The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints. [electronic resource] by Kang, Min-Soo Kim, Do-Seok Shin, Young-Eui Publication details: Materials (Basel, Switzerland) Mar 2019 In: Materials (Basel, Switzerland) vol. 12 Online resources: Available from publisher's website Availability: No items available. Save to lists Add to cart (remove)
	2.	Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn⁻Ag⁻Cu Solder on a Cu Substrate. [electronic resource] by Kang, Min-Soo Kim, Do-Seok Shin, Young-Eui Publication details: Materials (Basel, Switzerland) Mar 2019 In: Materials (Basel, Switzerland) vol. 12 Online resources: Available from publisher's website Availability: No items available. Save to lists Add to cart (remove)

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