Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn⁻Ag⁻Cu Solder on a Cu Substrate. [electronic resource]

By: Contributor(s): Publication details: Materials (Basel, Switzerland) Mar 2019ISSN:
  • 1996-1944
Online resources: In: Materials (Basel, Switzerland) vol. 12
Tags from this library: No tags from this library for this title. Log in to add tags.
Star ratings
    Average rating: 0.0 (0 votes)
No physical items for this record

Publication Type: Journal Article

There are no comments on this title.

to post a comment.