The Influence of Pulsed Electroplating Frequency and Duty Cycle on Copper Film Microstructure and Stress State. (Record no. 26915572)

MARC details
000 -LEADER
fixed length control field 00834 a2200229 4500
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20250517141606.0
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field ####s 0 0 eng d
022 ## - INTERNATIONAL STANDARD SERIAL NUMBER
International Standard Serial Number 0040-6090
024 7# - OTHER STANDARD IDENTIFIER
Standard number or code 10.1016/j.tsf.2016.11.047
Source of number or code doi
040 ## - CATALOGING SOURCE
Original cataloging agency NLM
Language of cataloging eng
Transcribing agency NLM
100 1# - MAIN ENTRY--PERSONAL NAME
Personal name Marro, James B
245 00 - TITLE STATEMENT
Title The Influence of Pulsed Electroplating Frequency and Duty Cycle on Copper Film Microstructure and Stress State.
Medium [electronic resource]
260 ## - PUBLICATION, DISTRIBUTION, ETC.
Name of publisher, distributor, etc. Thin solid films
Date of publication, distribution, etc. Jan 2017
300 ## - PHYSICAL DESCRIPTION
Extent 91-97 p.
Other physical details digital
500 ## - GENERAL NOTE
General note Publication Type: Journal Article
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Darroudi, Taghi
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Okoro, Chukwudi A
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Obeng, Yaw S
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Richardson, Kathleen C
773 0# - HOST ITEM ENTRY
Title Thin solid films
Related parts vol. 621
-- p. 91-97
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier <a href="https://doi.org/10.1016/j.tsf.2016.11.047">https://doi.org/10.1016/j.tsf.2016.11.047</a>
Public note Available from publisher's website

No items available.