Robustly Engineering Thermal Conductivity of Bilayer Graphene by Interlayer Bonding. [electronic resource]

By: Contributor(s): Producer: 20160815Description: 22011 p. digitalISSN:
  • 2045-2322
Online resources: In: Scientific reports vol. 6
Tags from this library: No tags from this library for this title. Log in to add tags.
Star ratings
    Average rating: 0.0 (0 votes)
No physical items for this record

Publication Type: Journal Article; Research Support, Non-U.S. Gov't

There are no comments on this title.

to post a comment.