Robustly Engineering Thermal Conductivity of Bilayer Graphene by Interlayer Bonding. (Record no. 25766671)

MARC details
000 -LEADER
fixed length control field 00801 a2200229 4500
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20250517082316.0
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 201608s 0 0 eng d
022 ## - INTERNATIONAL STANDARD SERIAL NUMBER
International Standard Serial Number 2045-2322
024 7# - OTHER STANDARD IDENTIFIER
Standard number or code 10.1038/srep22011
Source of number or code doi
040 ## - CATALOGING SOURCE
Original cataloging agency NLM
Language of cataloging eng
Transcribing agency NLM
100 1# - MAIN ENTRY--PERSONAL NAME
Personal name Zhang, Xiaoliang
264 #0 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE
Date of production, publication, distribution, manufacture, or copyright notice 20160815
245 00 - TITLE STATEMENT
Title Robustly Engineering Thermal Conductivity of Bilayer Graphene by Interlayer Bonding.
Medium [electronic resource]
260 ## - PUBLICATION, DISTRIBUTION, ETC.
Name of publisher, distributor, etc. Scientific reports
Date of publication, distribution, etc. Feb 2016
300 ## - PHYSICAL DESCRIPTION
Extent 22011 p.
Other physical details digital
500 ## - GENERAL NOTE
General note Publication Type: Journal Article; Research Support, Non-U.S. Gov't
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Gao, Yufei
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Chen, Yuli
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Hu, Ming
773 0# - HOST ITEM ENTRY
Title Scientific reports
Related parts vol. 6
-- p. 22011
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier <a href="https://doi.org/10.1038/srep22011">https://doi.org/10.1038/srep22011</a>
Public note Available from publisher's website

No items available.