Multilayered skyscraper microchips fabricated by hybrid "all-in-one" femtosecond laser processing.

Wang, Chaowei

Multilayered skyscraper microchips fabricated by hybrid "all-in-one" femtosecond laser processing. [electronic resource] - Microsystems & nanoengineering 2019 - 17 p. digital

Publication Type: Journal Article

ISSN: 2055-7434

Standard No.: 10.1038/s41378-019-0056-3 doi

Multilayered skyscraper microchips fabricated by hybrid "all-in-one" femtosecond laser processing.

APA

Wang C., Yang L., Zhang C., Rao S., Wang Y., Wu S., Li J., Hu Y., Wu D., Chu J. & Sugioka K. (2019). Multilayered skyscraper microchips fabricated by hybrid "all-in-one" femtosecond laser processing. : Microsystems & nanoengineering.

Chicago

Wang Chaowei, Yang Liang, Zhang Chenchu, Rao Shenglong, Wang Yulong, Wu Sizhu, Li Jiawen, Hu Yanlei, Wu Dong, Chu Jiaru and Sugioka Koji. 2019. Multilayered skyscraper microchips fabricated by hybrid "all-in-one" femtosecond laser processing. : Microsystems & nanoengineering.

Harvard

Wang C., Yang L., Zhang C., Rao S., Wang Y., Wu S., Li J., Hu Y., Wu D., Chu J. and Sugioka K. (2019). Multilayered skyscraper microchips fabricated by hybrid "all-in-one" femtosecond laser processing. : Microsystems & nanoengineering.

MLA

Wang Chaowei, Yang Liang, Zhang Chenchu, Rao Shenglong, Wang Yulong, Wu Sizhu, Li Jiawen, Hu Yanlei, Wu Dong, Chu Jiaru and Sugioka Koji. Multilayered skyscraper microchips fabricated by hybrid "all-in-one" femtosecond laser processing. : Microsystems & nanoengineering. 2019.

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