| 000 | 00925 a2200265 4500 | ||
|---|---|---|---|
| 005 | 20250517211658.0 | ||
| 008 | ####s 0 0 eng d | ||
| 022 | _a2045-2322 | ||
| 024 | 7 |
_a10.1038/s41598-018-23809-1 _2doi |
|
| 040 |
_aNLM _beng _cNLM |
||
| 100 | 1 | _aChang, Yuan-Wei | |
| 245 | 0 | 0 |
_aA new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps. _h[electronic resource] |
| 260 |
_bScientific reports _cApr 2018 |
||
| 300 |
_a5935 p. _bdigital |
||
| 500 | _aPublication Type: Journal Article | ||
| 700 | 1 | _aHu, Chia-Chia | |
| 700 | 1 | _aPeng, Hsin-Ying | |
| 700 | 1 | _aLiang, Yu-Chun | |
| 700 | 1 | _aChen, Chih | |
| 700 | 1 | _aChang, Tao-Chih | |
| 700 | 1 | _aZhan, Chau-Jie | |
| 700 | 1 | _aJuang, Jing-Ye | |
| 773 | 0 |
_tScientific reports _gvol. 8 _gno. 1 _gp. 5935 |
|
| 856 | 4 | 0 |
_uhttps://doi.org/10.1038/s41598-018-23809-1 _zAvailable from publisher's website |
| 999 |
_c28283093 _d28283093 |
||