| 000 | 01021 a2200253 4500 | ||
|---|---|---|---|
| 005 | 20250517161845.0 | ||
| 264 | 0 | _c20180511 | |
| 008 | 201805s 0 0 eng d | ||
| 022 | _a1091-6490 | ||
| 024 | 7 |
_a10.1073/pnas.1707849114 _2doi |
|
| 040 |
_aNLM _beng _cNLM |
||
| 100 | 1 | _aChang, Jan-Kai | |
| 245 | 0 | 0 |
_aMaterials and processing approaches for foundry-compatible transient electronics. _h[electronic resource] |
| 260 |
_bProceedings of the National Academy of Sciences of the United States of America _c07 2017 |
||
| 300 |
_aE5522-E5529 p. _bdigital |
||
| 500 | _aPublication Type: Journal Article; Research Support, Non-U.S. Gov't | ||
| 700 | 1 | _aFang, Hui | |
| 700 | 1 | _aBower, Christopher A | |
| 700 | 1 | _aSong, Enming | |
| 700 | 1 | _aYu, Xinge | |
| 700 | 1 | _aRogers, John A | |
| 773 | 0 |
_tProceedings of the National Academy of Sciences of the United States of America _gvol. 114 _gno. 28 _gp. E5522-E5529 |
|
| 856 | 4 | 0 |
_uhttps://doi.org/10.1073/pnas.1707849114 _zAvailable from publisher's website |
| 999 |
_c27314209 _d27314209 |
||