| 000 | 01054 a2200277 4500 | ||
|---|---|---|---|
| 005 | 20250517010142.0 | ||
| 264 | 0 | _c20160418 | |
| 008 | 201604s 0 0 eng d | ||
| 022 | _a1473-0189 | ||
| 024 | 7 |
_a10.1039/c4lc01254b _2doi |
|
| 040 |
_aNLM _beng _cNLM |
||
| 100 | 1 | _aUba, Franklin I | |
| 245 | 0 | 0 |
_aHigh process yield rates of thermoplastic nanofluidic devices using a hybrid thermal assembly technique. _h[electronic resource] |
| 260 |
_bLab on a chip _cFeb 2015 |
||
| 300 |
_a1038-49 p. _bdigital |
||
| 500 | _aPublication Type: Journal Article; Research Support, N.I.H., Extramural; Research Support, U.S. Gov't, Non-P.H.S. | ||
| 650 | 0 | 4 |
_aMicrofluidics _xinstrumentation |
| 650 | 0 | 4 |
_aNanotechnology _xinstrumentation |
| 650 | 0 | 4 | _aTemperature |
| 700 | 1 | _aHu, Bo | |
| 700 | 1 | _aWeerakoon-Ratnayake, Kumuditha | |
| 700 | 1 | _aOliver-Calixte, Nyote | |
| 700 | 1 | _aSoper, Steven A | |
| 773 | 0 |
_tLab on a chip _gvol. 15 _gno. 4 _gp. 1038-49 |
|
| 856 | 4 | 0 |
_uhttps://doi.org/10.1039/c4lc01254b _zAvailable from publisher's website |
| 999 |
_c24461545 _d24461545 |
||