| 000 | 00752 a2200205 4500 | ||
|---|---|---|---|
| 005 | 20250517003028.0 | ||
| 264 | 0 | _c20150519 | |
| 008 | 201505s 0 0 eng d | ||
| 022 | _a2045-2322 | ||
| 024 | 7 |
_a10.1038/srep07117 _2doi |
|
| 040 |
_aNLM _beng _cNLM |
||
| 100 | 1 | _aHuang, M L | |
| 245 | 0 | 0 |
_aSize effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate. _h[electronic resource] |
| 260 |
_bScientific reports _cNov 2014 |
||
| 300 |
_a7117 p. _bdigital |
||
| 500 | _aPublication Type: Journal Article; Research Support, Non-U.S. Gov't | ||
| 700 | 1 | _aYang, F | |
| 773 | 0 |
_tScientific reports _gvol. 4 _gp. 7117 |
|
| 856 | 4 | 0 |
_uhttps://doi.org/10.1038/srep07117 _zAvailable from publisher's website |
| 999 |
_c24364646 _d24364646 |
||