| 000 | 01191 a2200349 4500 | ||
|---|---|---|---|
| 005 | 20250516230110.0 | ||
| 264 | 0 | _c20150420 | |
| 008 | 201504s 0 0 eng d | ||
| 022 | _a1537-744X | ||
| 024 | 7 |
_a10.1155/2014/807693 _2doi |
|
| 040 |
_aNLM _beng _cNLM |
||
| 100 | 1 | _aMi, Jinhua | |
| 245 | 0 | 0 |
_aThermal cycling life prediction of Sn-3.0Ag-0.5Cu solder joint using type-I censored data. _h[electronic resource] |
| 260 |
_bTheScientificWorldJournal _c2014 |
||
| 300 |
_a807693 p. _bdigital |
||
| 500 | _aPublication Type: Journal Article; Research Support, Non-U.S. Gov't | ||
| 650 | 0 | 4 |
_aCopper _xchemistry |
| 650 | 0 | 4 | _aElectronics |
| 650 | 0 | 4 | _aEquipment Failure Analysis |
| 650 | 0 | 4 | _aHot Temperature |
| 650 | 0 | 4 | _aMaterials Testing |
| 650 | 0 | 4 | _aMicroscopy, Electron, Scanning |
| 650 | 0 | 4 | _aModels, Chemical |
| 650 | 0 | 4 |
_aSilver _xchemistry |
| 650 | 0 | 4 |
_aTin Compounds _xchemistry |
| 700 | 1 | _aLi, Yan-Feng | |
| 700 | 1 | _aYang, Yuan-Jian | |
| 700 | 1 | _aPeng, Weiwen | |
| 700 | 1 | _aHuang, Hong-Zhong | |
| 773 | 0 |
_tTheScientificWorldJournal _gvol. 2014 _gp. 807693 |
|
| 856 | 4 | 0 |
_uhttps://doi.org/10.1155/2014/807693 _zAvailable from publisher's website |
| 999 |
_c24096220 _d24096220 |
||