| 000 | 01118 a2200289 4500 | ||
|---|---|---|---|
| 005 | 20250511234711.0 | ||
| 264 | 0 | _c19900629 | |
| 008 | 199006s 0 0 eng d | ||
| 022 | _a0018-9294 | ||
| 024 | 7 |
_a10.1109/10.55650 _2doi |
|
| 040 |
_aNLM _beng _cNLM |
||
| 100 | 1 | _aSoma, M | |
| 245 | 0 | 0 |
_aA package design technique for size reduction of implantable bioelectronic systems. _h[electronic resource] |
| 260 |
_bIEEE transactions on bio-medical engineering _cMay 1990 |
||
| 300 |
_a482-8 p. _bdigital |
||
| 500 | _aPublication Type: Journal Article; Research Support, U.S. Gov't, P.H.S. | ||
| 650 | 0 | 4 | _aCochlear Implants |
| 650 | 0 | 4 | _aElectric Conductivity |
| 650 | 0 | 4 |
_aElectronics _xinstrumentation |
| 650 | 0 | 4 |
_aElectronics, Medical _xinstrumentation |
| 650 | 0 | 4 | _aEquipment Design |
| 650 | 0 | 4 |
_aMiniaturization _xinstrumentation |
| 650 | 0 | 4 | _aProstheses and Implants |
| 650 | 0 | 4 | _aSignal Processing, Computer-Assisted |
| 773 | 0 |
_tIEEE transactions on bio-medical engineering _gvol. 37 _gno. 5 _gp. 482-8 |
|
| 856 | 4 | 0 |
_uhttps://doi.org/10.1109/10.55650 _zAvailable from publisher's website |
| 999 |
_c2351076 _d2351076 |
||