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	1.	Co-Precipitation, Strength and Electrical Resistivity of Cu-26 wt % Ag-0.1 wt % Fe Alloy. [electronic resource] by Li, Rui Wang, Engang Zuo, Xiaowei Publication details: Materials (Basel, Switzerland) Dec 2017 In: Materials (Basel, Switzerland) vol. 10 Online resources: Available from publisher's website Availability: No items available. Save to lists Add to cart (remove)
	2.	Influence of Growth Rate and Magnetic Field on Microstructure and Properties of Directionally Solidified Ag-Cu Eutectic Alloy. [electronic resource] by Zuo, Xiaowei Zhao, Congcong Zhang, Lin Wang, Engang Publication details: Materials (Basel, Switzerland) Jul 2016 In: Materials (Basel, Switzerland) vol. 9 Online resources: Available from publisher's website Availability: No items available. Save to lists Add to cart (remove)
	3.	Numerical Simulation of Droplets Behavior of Cu-Pb Immiscible Alloys Solidifying under Magnetic Field. [electronic resource] by Zhang, Lin Man, Tiannan Huang, Minghao Gao, Jianwen Zuo, Xiaowei Wang, Engang Publication details: Materials (Basel, Switzerland) Aug 2017 In: Materials (Basel, Switzerland) vol. 10 Online resources: Available from publisher's website Availability: No items available. Save to lists Add to cart (remove)
	4.	Influence of grain boundary characteristics on thermal stability in nanotwinned copper. [electronic resource] by Niu, Rongmei Han, Ke Su, Yi-Feng Besara, Tiglet Siegrist, Theo M Zuo, Xiaowei Producer: 20180424 In: Scientific reports vol. 6 Online resources: Available from publisher's website Availability: No items available. Save to lists Add to cart (remove)