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Results of search for 'au:"Yan, Jiuchun"'
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Authors
Bai, Lixin
Bao, Juncheng
Chen, Xiaoguang
Cui, Wei
Guo, Weibing
He, Jingshan
Leng, Xuesong
Li, Chao
Li, Zhengwei
Lin, Weijun
Liu, Xuesong
Luan, Tianmin
Ma, Lin
Ma, Zhipeng
Wang, Sheng
Wu, Bingzhi
Wu, Pengfei
Xiu, Ziyang
Xu, Zhiwu
Yan, Jiuchun
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Alloys
Aluminum
High-Energy Shock Waves
Materials Testing
Radiation Dosage
Shear Strength
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Titanium
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Zinc Compounds
analysis
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Your search returned 19 results.
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1.
Stability of cavitation structures in a thin liquid layer.
[electronic resource]
by
Wu, Pengfei
Bai, Lixin
Lin, Weijun
Yan, Jiuchun
Producer:
20180307
In:
Ultrasonics sonochemistry
vol. 38
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2.
Microstructural evolution of SiC joints soldered using Zn-Al filler metals with the assistance of ultrasound.
[electronic resource]
by
Wu, Bingzhi
Leng, Xuesong
Xiu, Ziyang
Yan, Jiuchun
Producer:
20180430
In:
Ultrasonics sonochemistry
vol. 44
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3.
Interfacial reaction of intermetallic compounds of ultrasonic-assisted brazed joints between dissimilar alloys of Ti6Al4V and Al4Cu1Mg.
[electronic resource]
by
Ma, Zhipeng
Zhao, Weiwei
Yan, Jiuchun
Li, Dacheng
Producer:
20110926
In:
Ultrasonics sonochemistry
vol. 18
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4.
Ultrasonic-assisted soldering of fine-grained 7034 aluminum alloy using Sn-Zn solders below 300°C.
[electronic resource]
by
Guo, Weibing
Luan, Tianmin
He, Jingshan
Yan, Jiuchun
Producer:
20180307
In:
Ultrasonics sonochemistry
vol. 40
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5.
Cavitation in thin liquid layer: A review.
[electronic resource]
by
Bai, Lixin
Yan, Jiuchun
Zeng, Zhijie
Ma, Yuhang
Producer:
20200513
In:
Ultrasonics sonochemistry
vol. 66
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6.
Building a nano-crystalline α-alumina layer at a liquid metal/sapphire interface by ultrasound.
[electronic resource]
by
Cui, Wei
Yan, Jiuchun
Dai, Yan
Li, Dandan
Producer:
20150330
In:
Ultrasonics sonochemistry
vol. 22
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7.
Ultrafast air bonding between SiC ceramic and SnAgTi alloy under the action of ultrasounds.
[electronic resource]
by
Wu, Bingzhi
Leng, Xuesong
Xiu, Ziyang
Yan, Jiuchun
Publication details:
Scientific reports
Nov 2018
In:
Scientific reports
vol. 8
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8.
Wetting and reaction promoted by ultrasound between sapphire and liquid Al-12Si alloy.
[electronic resource]
by
Cui, Wei
Wang, Changwen
Yan, Jiuchun
Wang, Zhipeng
Wei, Daqing
Producer:
20130328
In:
Ultrasonics sonochemistry
vol. 20
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9.
Control Al/Mg intermetallic compound formation during ultrasonic-assisted soldering Mg to Al.
[electronic resource]
by
Xu, Zhiwu
Li, Zhengwei
Li, Jiaqi
Ma, Zhipeng
Yan, Jiuchun
Producer:
20180516
In:
Ultrasonics sonochemistry
vol. 46
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10.
Wetting mechanism of Sn to Zr
[electronic resource]
by
Xu, Zhiwu
Li, Zhengwei
Zhong, Shijiang
Ma, Zhipeng
Yan, Jiuchun
Producer:
20180807
In:
Ultrasonics sonochemistry
vol. 48
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11.
Grain refinement caused by intensified cavitation within narrow channel and its improvement to ultrasonically soldered Al joint property.
[electronic resource]
by
Li, Zhengwei
Xu, Zhiwu
Zhao, Degang
Liu, Xuesong
Yan, Jiuchun
Producer:
20191209
In:
Ultrasonics sonochemistry
vol. 60
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12.
Vibration characteristics of aluminum surface subjected to ultrasonic waves and their effect on wetting behavior of solder droplets.
[electronic resource]
by
Ma, Lin
Xu, Zhiwu
Zheng, Kun
Yan, Jiuchun
Yang, Shiqin
Producer:
20140225
In:
Ultrasonics
vol. 54
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13.
Ultrasonic-promoted rapid TLP bonding of fine-grained 7034 high strength aluminum alloys.
[electronic resource]
by
Guo, Weibing
Leng, Xuesong
Luan, Tianmin
Yan, Jiuchun
He, Jingshan
Producer:
20180307
In:
Ultrasonics sonochemistry
vol. 36
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14.
Interaction behaviors at the interface between liquid Al-Si and solid Ti-6Al-4V in ultrasonic-assisted brazing in air.
[electronic resource]
by
Chen, Xiaoguang
Yan, Jiuchun
Gao, Fei
Wei, Jinghui
Xu, Zhiwu
Fan, Guohua
Producer:
20130328
In:
Ultrasonics sonochemistry
vol. 20
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15.
Rod-shaped cavitation bubble structure in ultrasonic field.
[electronic resource]
by
Bai, Lixin
Wu, Pengfei
Liu, Huiyu
Yan, Jiuchun
Su, Chang
Li, Chao
Producer:
20180430
In:
Ultrasonics sonochemistry
vol. 44
Online resources:
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16.
Cavitation at filler metal/substrate interface during ultrasonic-assisted soldering. Part I: Cavitation characteristics.
[electronic resource]
by
Li, Zhengwei
Xu, Zhiwu
Ma, Lin
Wang, Sheng
Liu, Xuesong
Yan, Jiuchun
Producer:
20180912
In:
Ultrasonics sonochemistry
vol. 49
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17.
Cavitation at filler metal/substrate interface during ultrasonic-assisted soldering. Part II: Cavitation erosion effect.
[electronic resource]
by
Li, Zhengwei
Xu, Zhiwu
Ma, Lin
Wang, Sheng
Liu, Xuesong
Yan, Jiuchun
Producer:
20181023
In:
Ultrasonics sonochemistry
vol. 50
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18.
Surface tension and quasi-emulsion of cavitation bubble cloud.
[electronic resource]
by
Bai, Lixin
Chen, Xiaoguang
Zhu, Gang
Xu, Weilin
Lin, Weijun
Wu, Pengfei
Li, Chao
Xu, Delong
Yan, Jiuchun
Producer:
20180306
In:
Ultrasonics sonochemistry
vol. 35
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19.
Rapid ultrasound-induced transient-liquid-phase bonding of Al-50Si alloys with Zn interlayer in air for electrical packaging application.
[electronic resource]
by
Wang, Qian
Chen, Xiaoguang
Zhu, Lin
Yan, Jiuchun
Lai, Zhiwei
Zhao, Pizhi
Bao, Juncheng
Lv, Guicai
You, Chen
Zhou, Xiaoyu
Zhang, Jian
Li, Yuntao
Producer:
20180105
In:
Ultrasonics sonochemistry
vol. 34
Online resources:
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