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A double-sided, single-chip integration scheme using through-silicon-via for neural sensing applications. [electronic resource] by
- Chang, Chih-Wei
- Chou, Lei-Chun
- Huang, Po-Tsang
- Wu, Shang-Lin
- Lee, Shih-Wei
- Chuang, Ching-Te
- Chen, Kuan-Neng
- Hwang, Wei
- Chen, Kuo-Hua
- Chiu, Chi-Tsung
- Tong, Ho-Ming
- Chiou, Jin-Chern
Producer: 20150925
In:
Biomedical microdevices vol. 17
Availability: No items available.
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2.5D heterogeneously integrated microsystem for high-density neural sensing applications. [electronic resource] by
- Huang, Po-Tsang
- Wu, Shang-Lin
- Huang, Yu-Chieh
- Chou, Lei-Chun
- Huang, Teng-Chieh
- Wang, Tang-Hsuan
- Lin, Yu-Rou
- Cheng, Chuan-An
- Shen, Wen-Wei
- Chuang, Ching-Te
- Chen, Kuan-Neng
- Chiou, Jin-Chern
- Hwang, Wei
- Tong, Ho-Ming
Producer: 20150916
In:
IEEE transactions on biomedical circuits and systems vol. 8
Availability: No items available.
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7.
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Ultrahigh-Density 256-Channel Neural Sensing Microsystem Using TSV-Embedded Neural Probes. [electronic resource] by
- Huang, Yu-Chieh
- Huang, Po-Tsang
- Wu, Shang-Lin
- Hu, Yu-Chen
- You, Yan-Huei
- Chen, Jr-Ming
- Huang, Yan-Yu
- Chang, Hsiao-Chun
- Lin, Yen-Han
- Duann, Jeng-Ren
- Chiu, Tzai-Wen
- Hwang, Wei
- Chen, Kuan-Neng
- Chuang, Ching-Te
- Chiou, Jin-Chern
Producer: 20171227
In:
IEEE transactions on biomedical circuits and systems vol. 11
Availability: No items available.
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