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	1.	Effect of interfacial condition on electromigration for narrow and wide copper interconnects. [electronic resource] by Cheng, Yi-Lung Wang, Ying-Lang Producer: 20080813 In: Journal of nanoscience and nanotechnology vol. 8 Online resources: Available from publisher's website Availability: No items available. Save to lists Add to cart (remove)
	2.	The integration solution of copper barrier deposition for nanometer interconnect process. [electronic resource] by Chen, Kei-Wei Wang, Ying-Lang Tsao, Jung-Chih Lo, Kuang-Yao Producer: 20080813 In: Journal of nanoscience and nanotechnology vol. 8 Online resources: Available from publisher's website Availability: No items available. Save to lists Add to cart (remove)
	3.	Study of nitrogen diffusion profile of low resistivity diffusion barrier by resputtering technology. [electronic resource] by Tsao, Jung-Chih Liu, Chuan-Pu Wang, Ying-Lang Chen, Kei-Wei Producer: 20090604 In: Journal of nanoscience and nanotechnology vol. 9 Online resources: Available from publisher's website Availability: No items available. Save to lists Add to cart (remove)
	4.	A novel synthesis of a CuInSe2 thin film from electrodeposited Cu-Se-In-Se precursors with three steps annealing. [electronic resource] by Hu, Shao-Yu Lee, Wen-Hsi Chang, Shih-Chieh Wang, Ying-Lang Producer: 20121024 In: Journal of nanoscience and nanotechnology vol. 12 Online resources: Available from publisher's website Availability: No items available. Save to lists Add to cart (remove)
	5.	Investigation the electroplating behavior of self formed CuMn barrier. [electronic resource] by Wu, Chia-Yang Lee, Wen-Hsi Chang, Shih-Chieh Wang, Ying-Lang Producer: 20130905 In: Journal of nanoscience and nanotechnology vol. 13 Online resources: Available from publisher's website Availability: No items available. Save to lists Add to cart (remove)
	6.	Direct alpha Ta formation on TaN by resputtering for low resistive diffusion barriers. [electronic resource] by Tsao, Jung-Chih Liu, Chuan-Pu Wang, Ying-Lang Chen, Kei-Wei Producer: 20080813 In: Journal of nanoscience and nanotechnology vol. 8 Online resources: Available from publisher's website Availability: No items available. Save to lists Add to cart (remove)
	7.	The effects of oxygen content on bonding configurations and properties of low-k organosilicate glass dielectric films. [electronic resource] by Chen, Sheng-Wen Liu, Chuan-Pu JangJian, Shiu-Ko Wang, Ying-Lang Producer: 20080813 In: Journal of nanoscience and nanotechnology vol. 8 Online resources: Available from publisher's website Availability: No items available. Save to lists Add to cart (remove)
	8.	Effect of under-layer treatment of Ta/TaN barrier film on corrosion between Cu seed and Ta in chemical-mechanical-polishing slurry. [electronic resource] by Lee, Wen-Hsi Hung, Chi-Cheng Wang, Yu-Sheng Chang, Shih-Chieh Wang, Ying-Lang Producer: 20101223 In: Journal of nanoscience and nanotechnology vol. 10 Online resources: Available from publisher's website Availability: No items available. Save to lists Add to cart (remove)
	9.	Microstructure and formation of copper oxide in the Cu electro-polishing process. [electronic resource] by Kung, Te-Ming Huang, Michael Rong-Shie Tsao, Jung-Chih Liu, Chuan-Pu Wang, Ying-Lang Producer: 20101230 In: Journal of nanoscience and nanotechnology vol. 10 Online resources: Available from publisher's website Availability: No items available. Save to lists Add to cart (remove)
	10.	A Study of Trimethylsilane (3MS) and Tetramethylsilane (4MS) Based α-SiCN:H/α-SiCO:H Diffusion Barrier Films. [electronic resource] by Chen, Sheng-Wen Wang, Yu-Sheng Hu, Shao-Yu Lee, Wen-Hsi Chi, Chieh-Cheng Wang, Ying-Lang Publication details: Materials (Basel, Switzerland) Mar 2012 In: Materials (Basel, Switzerland) vol. 5 Online resources: Available from publisher's website Availability: No items available. Save to lists Add to cart (remove)