Manufacture and Evaluation of Light Emitting Diode Package Substrate Using Flexible Printed Circuit Board. [electronic resource]

By: Contributor(s): Producer: 20160208Description: 7578-81 p. digitalISSN:
  • 1533-4899
Online resources: In: Journal of nanoscience and nanotechnology vol. 15
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Publication Type: Journal Article; Research Support, Non-U.S. Gov't

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