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Results of search for 'au:"Seo, Yeong-Hui"'
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Authors
An, Ki-Seok
Chae, Changju
Cho, Song Yun
Choi, Sungho
Choi, Youngmin
Han, Gayoung
Jang, Kwang-Suk
Jeon, Hye-Ji
Jeong, Sunho
Jo, Yejin
Jung, Sungmook
Kang, Young Hun
Kim, Han-Gyeol
Kim, Hyun-Suk
Kim, Ju Young
Kim, Ki Woong
Kim, So-Yun
Lee, Sun Sook
Ryu, Beyong-Hwan
Seo, Yeong-Hui
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Your search returned 5 results.
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1.
Long-term dispersion stability and adhesion promotion of aqueous Cu nano-ink for flexible printed electronics.
[electronic resource]
by
Seo, Yeong-Hui
Jeong, Sunho
Jo, Yejin
Choi, Youngmin
Ryu, Beyong-Hwan
Han, Gayoung
Lee, Minsu
Producer:
20130905
In:
Journal of nanoscience and nanotechnology
vol. 13
Online resources:
Available from publisher's website
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No items available.
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2.
Study on thermal evolution of the CuSe phase in nanoparticle-based absorber layers for solution-processed chalcopyrite photovoltaic devices.
[electronic resource]
by
Seo, Yeong-Hui
Lee, Byung-Seok
Jo, Yejin
Kim, Han-Gyeol
Woo, Kyoohee
Moon, Jooho
Choi, Youngmin
Ryu, Beyong-Hwan
Jeong, Sunho
Producer:
20131210
In:
ACS applied materials & interfaces
vol. 5
Online resources:
Available from publisher's website
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No items available.
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3.
3D-stacked carbon composites employing networked electrical intra-pathways for direct-printable, extremely stretchable conductors.
[electronic resource]
by
Chae, Changju
Seo, Yeong-Hui
Jo, Yejin
Kim, Ki Woong
Song, Wooseok
An, Ki-Seok
Choi, Sungho
Choi, Youngmin
Lee, Sun Sook
Jeong, Sunho
Producer:
20150511
In:
ACS applied materials & interfaces
vol. 7
Online resources:
Available from publisher's website
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4.
3D-printable, highly conductive hybrid composites employing chemically-reinforced, complex dimensional fillers and thermoplastic triblock copolymers.
[electronic resource]
by
Jo, Yejin
Kim, Ju Young
Kim, So-Yun
Seo, Yeong-Hui
Jang, Kwang-Suk
Lee, Su Yeon
Jung, Sungmook
Ryu, Beyong-Hwan
Kim, Hyun-Suk
Park, Jang-Ung
Choi, Youngmin
Jeong, Sunho
Producer:
20180719
In:
Nanoscale
vol. 9
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5.
Ambient atmosphere-processable, printable Cu electrodes for flexible device applications: structural welding on a millisecond timescale of surface oxide-free Cu nanoparticles.
[electronic resource]
by
Oh, Sang-Jin
Jo, Yejin
Lee, Eun Jung
Lee, Sun Sook
Kang, Young Hun
Jeon, Hye-Ji
Cho, Song Yun
Park, Jin-Seong
Seo, Yeong-Hui
Ryu, Beyong-Hwan
Choi, Youngmin
Jeong, Sunho
Producer:
20150710
In:
Nanoscale
vol. 7
Online resources:
Available from publisher's website
Availability:
No items available.
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