Stress evolution during annealing of Cu/Au, Cu/Ag and Au/Ag bilayers. [electronic resource]

By: Contributor(s): Producer: 20130404Description: 8647-50 p. digitalISSN:
  • 1533-4880
Subject(s): Online resources: In: Journal of nanoscience and nanotechnology vol. 12
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Publication Type: Comparative Study; Journal Article; Research Support, Non-U.S. Gov't

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