Ultrahigh Conductivity and Superior Interfacial Adhesion of a Nanostructured, Photonic-Sintered Copper Membrane for Printed Flexible Hybrid Electronics. [electronic resource]

By: Contributor(s): Producer: 20190304Description: 44071-44079 p. digitalISSN:
  • 1944-8252
Online resources: In: ACS applied materials & interfaces vol. 10
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Publication Type: Journal Article

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