APA

Boeser F., Lang B. G., Stieglitz T. & Plachta D. T. T. (20170908). Epoxy casting used as nonhermetic encapsulation technique for implantable electronic devices. : Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference.

Chicago

Boeser Fabian, Lang Benjamin G, Stieglitz Thomas and Plachta Dennis T T. 20170908. Epoxy casting used as nonhermetic encapsulation technique for implantable electronic devices. : Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference.

Harvard

Boeser F., Lang B. G., Stieglitz T. and Plachta D. T. T. (20170908). Epoxy casting used as nonhermetic encapsulation technique for implantable electronic devices. : Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference.

MLA

Boeser Fabian, Lang Benjamin G, Stieglitz Thomas and Plachta Dennis T T. Epoxy casting used as nonhermetic encapsulation technique for implantable electronic devices. : Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference. 20170908.