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	1.	Selective Ru ALD as a Catalyst for Sub-Seven-Nanometer Bottom-Up Metal Interconnects. [electronic resource] by Zyulkov, Ivan Krishtab, Mikhail De Gendt, Stefan Armini, Silvia Producer: 20180730 In: ACS applied materials & interfaces vol. 9 Online resources: Available from publisher's website Availability: No items available. Save to lists Add to cart (remove)
	2.	Impact of plasma pretreatment and pore size on the sealing of ultra-low-k dielectrics by self-assembled monolayers. [electronic resource] by Sun, Yiting Krishtab, Mikhail Struyf, Herbert Verdonck, Patrick De Feyter, Steven Baklanov, Mikhail R Armini, Silvia Producer: 20150413 In: Langmuir : the ACS journal of surfaces and colloids vol. 30 Online resources: Available from publisher's website Availability: No items available. Save to lists Add to cart (remove)
	3.	Vapor-deposited zeolitic imidazolate frameworks as gap-filling ultra-low-k dielectrics. [electronic resource] by Krishtab, Mikhail Stassen, Ivo Stassin, Timothée Cruz, Alexander John Okudur, Oguzhan Orkut Armini, Silvia Wilson, Chris De Gendt, Stefan Ameloot, Rob Publication details: Nature communications Aug 2019 In: Nature communications vol. 10 Online resources: Available from publisher's website Availability: No items available. Save to lists Add to cart (remove)

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