APA

Lin D., Wodnicki R., Zhuang X., Woychik C., Thomenius K. E., Fisher R. A., Mills D. M., Byun A. J., Burdick W., Khuri-Yakub P., Bonitz B., Davies T., Thomas G., Otto B., Töpper M., Fritzsch T. & Ehrmann O. (20150511). Packaging and modular assembly of large-area and fine-pitch 2-D ultrasonic transducer arrays. : IEEE transactions on ultrasonics, ferroelectrics, and frequency control.

Chicago

Lin Der-Song, Wodnicki Robert, Zhuang Xuefeng, Woychik Charles, Thomenius Kai E, Fisher Rayette A, Mills David M, Byun Albert J, Burdick William, Khuri-Yakub Pierre, Bonitz Barry, Davies Todd, Thomas Glen, Otto Bernd, Töpper Michael, Fritzsch Thomas and Ehrmann Oswin. 20150511. Packaging and modular assembly of large-area and fine-pitch 2-D ultrasonic transducer arrays. : IEEE transactions on ultrasonics, ferroelectrics, and frequency control.

Harvard

Lin D., Wodnicki R., Zhuang X., Woychik C., Thomenius K. E., Fisher R. A., Mills D. M., Byun A. J., Burdick W., Khuri-Yakub P., Bonitz B., Davies T., Thomas G., Otto B., Töpper M., Fritzsch T. and Ehrmann O. (20150511). Packaging and modular assembly of large-area and fine-pitch 2-D ultrasonic transducer arrays. : IEEE transactions on ultrasonics, ferroelectrics, and frequency control.

MLA

Lin Der-Song, Wodnicki Robert, Zhuang Xuefeng, Woychik Charles, Thomenius Kai E, Fisher Rayette A, Mills David M, Byun Albert J, Burdick William, Khuri-Yakub Pierre, Bonitz Barry, Davies Todd, Thomas Glen, Otto Bernd, Töpper Michael, Fritzsch Thomas and Ehrmann Oswin. Packaging and modular assembly of large-area and fine-pitch 2-D ultrasonic transducer arrays. : IEEE transactions on ultrasonics, ferroelectrics, and frequency control. 20150511.