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	1.	Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu. [electronic resource] by Juang, Jing-Ye Lu, Chia-Ling Li, Yu-Jin Tu, K N Chen, Chih Publication details: Materials (Basel, Switzerland) Nov 2018 In: Materials (Basel, Switzerland) vol. 11 Online resources: Available from publisher's website Availability: No items available. Save to lists Add to cart (remove)
	2.	Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient. [electronic resource] by Juang, Jing-Ye Lu, Chia-Ling Chen, Kuan-Ju Chen, Chao-Chang A Hsu, Po-Ning Chen, Chih Tu, K N Publication details: Scientific reports Sep 2018 In: Scientific reports vol. 8 Online resources: Available from publisher's website Availability: No items available. Save to lists Add to cart (remove)
	3.	A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps. [electronic resource] by Chang, Yuan-Wei Hu, Chia-Chia Peng, Hsin-Ying Liang, Yu-Chun Chen, Chih Chang, Tao-Chih Zhan, Chau-Jie Juang, Jing-Ye Publication details: Scientific reports Apr 2018 In: Scientific reports vol. 8 Online resources: Available from publisher's website Availability: No items available. Save to lists Add to cart (remove)

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