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748.
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Packaging and modular assembly of large-area and fine-pitch 2-D ultrasonic transducer arrays. [electronic resource] by
- Lin, Der-Song
- Wodnicki, Robert
- Zhuang, Xuefeng
- Woychik, Charles
- Thomenius, Kai E
- Fisher, Rayette A
- Mills, David M
- Byun, Albert J
- Burdick, William
- Khuri-Yakub, Pierre
- Bonitz, Barry
- Davies, Todd
- Thomas, Glen
- Otto, Bernd
- Töpper, Michael
- Fritzsch, Thomas
- Ehrmann, Oswin
Producer: 20150511
In:
IEEE transactions on ultrasonics, ferroelectrics, and frequency control vol. 60
Availability: No items available.
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