Zhao, Di <br/><br/>
Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging.  [electronic resource] 

 -  Materials (Basel, Switzerland)  Feb 2020 
<br/><br/> Publication Type: Journal Article 
<br/><br/><label>ISSN: </label>1996-1944 
<br/><br/><label>Standard No.: </label>10.3390/ma13040831  doi