Hauser, Steven C <br/><br/>
Imaging the 3-D Deformation of the Finger Pad When Interacting with Compliant Materials.  [electronic resource] 

 -  IEEE Haptics Symposium : [proceedings]. IEEE Haptics Symposium  Mar 2018 
 - 7-13 p.  digital 
<br/><br/> Publication Type: Journal Article 
<br/><br/><label>ISSN: </label>2324-7347 
<br/><br/><label>Standard No.: </label>10.1109/HAPTICS.2018.8357145  doi