TY  - GEN
AU  - Kang,Min-Soo
AU  - Kim,Do-Seok
AU  - Shin,Young-Eui
TI  - Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn⁻Ag⁻Cu Solder on a Cu Substrate
SN  - 1996-1944
PY  - 2019///
PB  - Materials (Basel, Switzerland)
N1  - Publication Type: Journal Article
UR  - https://doi.org/10.3390/ma12060936
ER  -