Kang, Min-Soo <br/><br/>
Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn⁻Ag⁻Cu Solder on a Cu Substrate.  [electronic resource] 

 -  Materials (Basel, Switzerland)  Mar 2019 
<br/><br/> Publication Type: Journal Article 
<br/><br/><label>ISSN: </label>1996-1944 
<br/><br/><label>Standard No.: </label>10.3390/ma12060936  doi