Shim, Jaewoo <br/><br/>
Controlled crack propagation for atomic precision handling of wafer-scale two-dimensional materials.  [electronic resource] 

 -  Science (New York, N.Y.)  11 2018 
 - 665-670 p.  digital 
<br/><br/> Publication Type: Journal Article; Research Support, Non-U.S. Gov't 
<br/><br/><label>ISSN: </label>1095-9203 
<br/><br/><label>Standard No.: </label>10.1126/science.aat8126  doi