Chang, Yuan-Wei <br/><br/>
A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps.  [electronic resource] 

 -  Scientific reports  Apr 2018 
 - 5935 p.  digital 
<br/><br/> Publication Type: Journal Article 
<br/><br/><label>ISSN: </label>2045-2322 
<br/><br/><label>Standard No.: </label>10.1038/s41598-018-23809-1  doi