TY  - GEN
AU  - Marro,James B
AU  - Darroudi,Taghi
AU  - Okoro,Chukwudi A
AU  - Obeng,Yaw S
AU  - Richardson,Kathleen C
TI  - The Influence of Pulsed Electroplating Frequency and Duty Cycle on Copper Film Microstructure and Stress State
SN  - 0040-6090
PY  - 2017///
PB  - Thin solid films
N1  - Publication Type: Journal Article
UR  - https://doi.org/10.1016/j.tsf.2016.11.047
ER  -