Marro, James B <br/><br/>
The Influence of Pulsed Electroplating Frequency and Duty Cycle on Copper Film Microstructure and Stress State.  [electronic resource] 

 -  Thin solid films  Jan 2017 
 - 91-97 p.  digital 
<br/><br/> Publication Type: Journal Article 
<br/><br/><label>ISSN: </label>0040-6090 
<br/><br/><label>Standard No.: </label>10.1016/j.tsf.2016.11.047  doi