TY  - GEN
AU  - Yang,Bin
AU  - Sharp,James S
AU  - Smith,Mike I
TI  - The interplay of crack hopping, delamination and interface failure in drying nanoparticle films
SN  - 2045-2322
PY  - 2018///0502
N1  - Publication Type: Journal Article; Research Support, Non-U.S. Gov't
UR  - https://doi.org/10.1038/srep32296
ER  -