Yang, Bin <br/><br/>
The interplay of crack hopping, delamination and interface failure in drying nanoparticle films.  [electronic resource] 

 -  Scientific reports  08 2016 
 - 32296 p.  digital 
<br/><br/> Publication Type: Journal Article; Research Support, Non-U.S. Gov't 
<br/><br/><label>ISSN: </label>2045-2322 
<br/><br/><label>Standard No.: </label>10.1038/srep32296  doi