Kim, Tae-Yoo <br/><br/>
Electroless nickel alloy deposition on SiO2 for application as a diffusion barrier and seed layer in 3D copper interconnect technology.  [electronic resource] 

 -  Journal of nanoscience and nanotechnology  Dec 2014 
 - 9515-24 p.  digital 
<br/><br/> Publication Type: Journal Article; Research Support, Non-U.S. Gov't 
<br/><br/><label>ISSN: </label>1533-4899 
<br/><br/><label>Standard No.: </label>10.1166/jnn.2014.10173  doi