Uba, Franklin I <br/><br/>
High process yield rates of thermoplastic nanofluidic devices using a hybrid thermal assembly technique.  [electronic resource] 

 -  Lab on a chip  Feb 2015 
 - 1038-49 p.  digital 
<br/><br/> Publication Type: Journal Article; Research Support, N.I.H., Extramural; Research Support, U.S. Gov't, Non-P.H.S. 
<br/><br/><label>ISSN: </label>1473-0189 
<br/><br/><label>Standard No.: </label>10.1039/c4lc01254b  doi 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microfluidics--instrumentation<br/>Nanotechnology--instrumentation<br/>Temperature