TY  - GEN
AU  - Huang,M L
AU  - Yang,F
TI  - Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate
SN  - 2045-2322
PY  - 2015///0519
N1  - Publication Type: Journal Article; Research Support, Non-U.S. Gov't
UR  - https://doi.org/10.1038/srep07117
ER  -