Huang, M L <br/><br/>
Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate.  [electronic resource] 

 -  Scientific reports  Nov 2014 
 - 7117 p.  digital 
<br/><br/> Publication Type: Journal Article; Research Support, Non-U.S. Gov't 
<br/><br/><label>ISSN: </label>2045-2322 
<br/><br/><label>Standard No.: </label>10.1038/srep07117  doi