Mi, Jinhua <br/><br/>
Thermal cycling life prediction of Sn-3.0Ag-0.5Cu solder joint using type-I censored data.  [electronic resource] 

 -  TheScientificWorldJournal  2014 
 - 807693 p.  digital 
<br/><br/> Publication Type: Journal Article; Research Support, Non-U.S. Gov't 
<br/><br/><label>ISSN: </label>1537-744X 
<br/><br/><label>Standard No.: </label>10.1155/2014/807693  doi 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Copper--chemistry<br/>Electronics<br/>Equipment Failure Analysis<br/>Hot Temperature<br/>Materials Testing<br/>Microscopy, Electron, Scanning<br/>Models, Chemical<br/>Silver--chemistry<br/>Tin Compounds--chemistry