TY  - GEN
AU  - Murahara,Sadaaki
AU  - Minami,Hiroyuki
AU  - Suzuki,Shiro
AU  - Sakoguchi,Kenji
AU  - Shiomuki,Daisaku
AU  - Minesaki,Yoshito
AU  - Tanaka,Takuo
TI  - Effect of adherend temperature on bond strengths of resin bonding systems to denture base resin and a semi-precious alloy
SN  - 1881-1361
PY  - 2014///0220
KW  - Adhesiveness
KW  - Boron Compounds
KW  - chemistry
KW  - Copper
KW  - Dental Alloys
KW  - Dental Bonding
KW  - Dental Polishing
KW  - methods
KW  - Denture Bases
KW  - Gold Alloys
KW  - Hot Temperature
KW  - Humans
KW  - Humidity
KW  - Materials Testing
KW  - Methacrylates
KW  - Methylmethacrylates
KW  - Microscopy, Electron, Scanning
KW  - Palladium
KW  - Polymerization
KW  - Polymethyl Methacrylate
KW  - Resin Cements
KW  - Shear Strength
KW  - Silver
KW  - Stress, Mechanical
KW  - Surface Properties
KW  - Temperature
KW  - Triazines
N1  - Publication Type: Journal Article
UR  - https://doi.org/10.4012/dmj.2012-189
ER  -