Murahara, Sadaaki <br/><br/>
Effect of adherend temperature on bond strengths of resin bonding systems to denture base resin and a semi-precious alloy.  [electronic resource] 

 -  Dental materials journal  2013 
 - 341-8 p.  digital 
<br/><br/> Publication Type: Journal Article 
<br/><br/><label>ISSN: </label>1881-1361 
<br/><br/><label>Standard No.: </label>10.4012/dmj.2012-189  doi 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Adhesiveness<br/>Boron Compounds--chemistry<br/>Copper--chemistry<br/>Dental Alloys--chemistry<br/>Dental Bonding<br/>Dental Polishing--methods<br/>Denture Bases<br/>Gold Alloys--chemistry<br/>Hot Temperature<br/>Humans<br/>Humidity<br/>Materials Testing<br/>Methacrylates--chemistry<br/>Methylmethacrylates--chemistry<br/>Microscopy, Electron, Scanning<br/>Palladium--chemistry<br/>Polymerization<br/>Polymethyl Methacrylate--chemistry<br/>Resin Cements--chemistry<br/>Shear Strength<br/>Silver--chemistry<br/>Stress, Mechanical<br/>Surface Properties<br/>Temperature<br/>Triazines--chemistry