Defforge, Thomas <br/><br/>
Copper-selective electrochemical filling of macropore arrays for through-silicon via applications.  [electronic resource] 

 -  Nanoscale research letters  Jul 2012 
 - 375 p.  digital 
<br/><br/> Publication Type: Journal Article 
<br/><br/><label>ISSN: </label>1556-276X 
<br/><br/><label>Standard No.: </label>10.1186/1556-276X-7-375  doi