TY  - GEN
AU  - Yoon,Junro
AU  - Choi,Dongjoo
AU  - Oh,Do-Hyun
AU  - Kim,T W
AU  - Kim,Young-Ho
TI  - Formation of copper based nanoparticles embedded in a relatively thick polyimide film by thermal curing in reducing atmosphere
SN  - 1533-4880
PY  - 2009///0305
N1  - Publication Type: Journal Article
UR  - https://doi.org/10.1166/jnn.2008.1100
ER  -