TY  - GEN
AU  - Pfeiffer,P
TI  - [Chemical bond of adhesive and palladium alloys]
SN  - 0044-166X
PY  - 1991///1003
KW  - Bisphenol A-Glycidyl Methacrylate
KW  - Dental Alloys
KW  - Dental Bonding
KW  - Materials Testing
KW  - Methacrylates
KW  - Methylmethacrylates
KW  - Palladium
KW  - Silanes
N1  - Publication Type: English Abstract; Journal Article
ER  -